The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces

Gründer, Y.; Renner, F. U.; Lee,, T. L.

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The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces

Gründer, Y., Renner, F. U., & Lee, T. L. (2009). The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces. Surface Science, 603(17), L105-L108.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-3FCB-2 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-3FCD-D

Genre: Journal Article

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Creators:
Gründer, Y., Author
Renner, F. U.¹, Author
Lee,, T. L., Author

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1Interface Structures and High-Temperature Reactions, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society

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Language(s): eng - English

Dates: Date issued: 2009-09-01

Publication Status: Issued

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Identifiers: eDoc: 452616

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Title: Surface Science

Source Genre: Journal

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Pages: - Volume / Issue: 603 (17) Sequence Number: - Start / End Page: L105 - L108 Identifier: -