The Relation Between Molecular Packing or Morphology and Chemical Structure or 
Processing Conditions: the Effect on Electronic Properties

Kumar, P.; Shivananda, K. N.; Zajaczkowski, Wojciech; Pisula, Wojciech; Eichen, Y.; Tessler, N.

doi:10.1002/adfm.201303571

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The Relation Between Molecular Packing or Morphology and Chemical Structure or Processing Conditions: the Effect on Electronic Properties

Kumar, P., Shivananda, K. N., Zajaczkowski, W., Pisula, W., Eichen, Y., & Tessler, N. (2014). The Relation Between Molecular Packing or Morphology and Chemical Structure or Processing Conditions: the Effect on Electronic Properties. Advanced Functional Materials, 24(17), 2530-2536. doi:10.1002/adfm.201303571.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-CE09-F Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-CE0A-D

Genre: Journal Article

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Creators:
Kumar, P. , Author
Shivananda, K. N., Author
Zajaczkowski, Wojciech¹, Author
Pisula, Wojciech¹, Author
Eichen, Y., Author
Tessler, N., Author

Affiliations:
1Dept. Müllen: Synthetic Chemistry, MPI for Polymer Research, Max Planck Society, ou_1800289

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Language(s): eng - English

Dates: Date issued: 2014

Publication Status: Issued

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Identifiers: DOI: 10.1002/adfm.201303571

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Title: Advanced Functional Materials

Other : Adv. Funct. Mater.

Source Genre: Journal

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Publ. Info: Weinheim : Wiley-VCH Verlag GmbH

Pages: - Volume / Issue: 24 (17) Sequence Number: - Start / End Page: 2530 - 2536 Identifier: ISSN: 1616-301X
CoNE: https://pure.mpg.de/cone/journals/resource/954925596563