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  A microindentation method for estimating interfacial shear strength and its use in studying the influence of titanium transition layers on the interface strength of epitaxial copper films on sapphire

Dehm, G., Rühle, M., Conway, H. D., & Raj, R. (1997). A microindentation method for estimating interfacial shear strength and its use in studying the influence of titanium transition layers on the interface strength of epitaxial copper films on sapphire. Acta Materialia, 45(2), 489-499. doi:10.1016/S1359-6454(96)00213-3.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-95AA-7 Version Permalink: https://hdl.handle.net/21.11116/0000-0001-95AB-6
Genre: Journal Article

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 Creators:
Dehm, Gerhard1, Author           
Rühle, Manfred2, Author           
Conway, Harry Donald3, Author           
Raj, Rishi4, 5, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              
3Depts. of Theor. and Appl. Mechanics, Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA, persistent22              
4Department of Materials Science and Engineering, Cornell University, Bard Hall, Ithaca, NY, 14853-1501, USA, persistent22              
5University of Colorado, Boulder, CO 80309-0427, USA, persistent22              

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Language(s): eng - English
 Dates: 1997-02
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: DOI: 10.1016/S1359-6454(96)00213-3
 Degree: -

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Title: Acta Materialia
  Abbreviation : Acta Mater.
Source Genre: Journal
 Creator(s):
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Publ. Info: -
Pages: - Volume / Issue: 45 (2) Sequence Number: - Start / End Page: 489 - 499 Identifier: ISSN: 1359-6454
CoNE: https://pure.mpg.de/cone/journals/resource/954928603100