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  High temperature Creep Behaviour of Al-rich TiAl Alloys

Sturm, D., Heilmaier, M., Saage, H., Schmitz, G. J., Drevermann, A., Paninski, M., et al. (2009). High temperature Creep Behaviour of Al-rich TiAl Alloys. Poster presented at ICSMA 15, 15th International Conference on the Strength of Materials, Dresden, Germany.

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 Creators:
Sturm, Daniel1, Author           
Heilmaier, Martin2, Author           
Saage, Holger2, Author           
Schmitz, Georg J.3, Author           
Drevermann, Anne3, Author           
Paninski, M.4, Author           
Stein, Frank5, Author           
Palm, Martin5, Author           
Engberding, Nico6, Author           
Kelm, Klemens7, Author           
Irsen, Stephan H.8, Author           
Affiliations:
1Otto-von-Guericke University Magdeburg, Institute for Materials Joining and Technology, D-39104 Magdeburg, Germany, ou_persistent22              
2Otto-von-Guericke-Universität Magdeburg, Institut für Werkstoff- und Fügetechnik, Lehrstuhl Werkstoffprüftechnik, Grobe Steinernetischstrabe 6, Magdeburg, Germany, ou_persistent22              
3ACCESS e.V., D-52072 Aachen, Germany, ou_persistent22              
4ACCESS e.V., Intzestraße 5, D-52072 Aachen, Germany, ou_persistent22              
5Intermetallic Materials, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863388              
6Development and Characterisation of New Materials, Materials Technology, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863368              
7Stiftung caesar, Electron Microscopy, Bonn, Germany, ou_persistent22              
8Research Center Caesar, Ludwig-Erhard-Allee 2, D-53175 Bonn, Germany, ou_persistent22              

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Language(s): eng - English
 Dates: 2009-08
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 446471
 Degree: -

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Title: ICSMA 15, 15th International Conference on the Strength of Materials
Place of Event: Dresden, Germany
Start-/End Date: 2009-08-16 - 2009-08-21

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