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  Temperature dependent mechanical characterization of sputtered Copper-Silver thin film tensile specimens produced by photolithography

Arigela, V. G., Oellers, T., Ludwig, A., Kirchlechner, C., & Dehm, G. (2018). Temperature dependent mechanical characterization of sputtered Copper-Silver thin film tensile specimens produced by photolithography. Poster presented at Materials Chain International Conference, Bochum, Germany, Bochum, Germany.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0005-470B-0 Version Permalink: https://hdl.handle.net/21.11116/0000-0005-470C-F
Genre: Poster

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 Creators:
Arigela, Viswanadh Gowtham1, Author           
Oellers, Tobias2, Author           
Ludwig, Alfred3, Author           
Kirchlechner, Christoph1, Author           
Dehm, Gerhard4, Author           
Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
2Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22              
3Chair for MEMS Materials, Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany und Materials Research Department, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22              
4Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2018-11
 Publication Status: Not specified
 Pages: -
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 Table of Contents: -
 Rev. Type: -
 Identifiers: -
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Title: Materials Chain International Conference, Bochum, Germany
Place of Event: Bochum, Germany
Start-/End Date: 2018-11-12 - 2018-11-14

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