Thermal stability of titanium nitride diffusion barrier films for advanced 
silver interconnects

Gao, L.; Gstöttner, J.; Emling, R.; Balden, M.; Linsmeier, Ch.; Wiltner, A.; Hansch, W.; Schmitt-Landsiedel, D.

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Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects

Gao, L., Gstöttner, J., Emling, R., Balden, M., Linsmeier, C., Wiltner, A., et al. (2004). Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects. Microelectronic Engineering, (76), 76-81.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-22EE-D Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-22EF-B

Genre: Journal Article

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Creators:
Gao, L.¹, Author
Gstöttner, J.², Author
Emling, R.², Author
Balden, M.³, Author
Linsmeier, Ch.³, Author
Wiltner, A.³, Author
Hansch, W.², Author
Schmitt-Landsiedel, D.², Author

Affiliations:
1External Organizations, ou_persistent22
2Institute for Technical Electronics, Technical University Munich, Theresienstr. 90, 80290 Munich, Germany, ou_persistent22
3Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856328

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Language(s): eng - English

Dates: Date issued: 2004

Publication Status: Issued

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Identifiers: eDoc: 289785

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Title: Microelectronic Engineering

Source Genre: Journal

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Pages: - Volume / Issue: (76) Sequence Number: - Start / End Page: 76 - 81 Identifier: -