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  Mechanical characterization of copper thin films produced by photolithography with a novel microscale high temperature loading rig

Arigela, V. G., Oellers, T., Ludwig, A., Kirchlechner, C., & Dehm, G. (2018). Mechanical characterization of copper thin films produced by photolithography with a novel microscale high temperature loading rig. Talk presented at The International Conference on Experimental Mechanics, (ICEM) 2018. Brussels, Belgium. 2018-07-01 - 2018-07-05.

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 Creators:
Arigela, Viswanadh Gowtham1, Author           
Oellers, Tobias2, Author           
Ludwig, A.3, Author           
Kirchlechner, Christoph1, Author           
Dehm, Gerhard4, Author           
Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
2Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22              
3Chair for MEMS Materials, Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany und Materials Research Department, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22              
4Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2018-07
 Publication Status: Not specified
 Pages: -
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 Rev. Type: -
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Title: The International Conference on Experimental Mechanics, (ICEM) 2018
Place of Event: Brussels, Belgium
Start-/End Date: 2018-07-01 - 2018-07-05

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