An elevated temperature study of a Ti adhesion layer on polyimide

Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.

doi:10.1016/j.tsf.2013.01.016

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An elevated temperature study of a Ti adhesion layer on polyimide

Taylor, A. A., Cordill, M. J., Bowles, L., Schalko, J., & Dehm, G. (2013). An elevated temperature study of a Ti adhesion layer on polyimide. Thin Solid Films, 531, 354-361. doi:10.1016/j.tsf.2013.01.016.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-2474-F Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-2476-B

Genre: Journal Article

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Creators:
Taylor, A. A., Author
Cordill, M. J., Author
Bowles, L., Author
Schalko, J., Author
Dehm, G.^{1, 2}, Author

Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Language(s): eng - English

Dates: Date issued: 2013-03-15

Publication Status: Issued

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Identifiers: eDoc: 634669
DOI: 10.1016/j.tsf.2013.01.016

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Title: Thin Solid Films

Alternative Title : Thin Solid Films

Source Genre: Journal

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Pages: - Volume / Issue: 531 Sequence Number: - Start / End Page: 354 - 361 Identifier: ISSN: 0040-6090