Influence of initial microstructure on thermomechanical fatigue behavior of Cu 
films on substrates

Heinz, Walther; Robl, Werner; Dehm, Gerhard

doi:10.1016/j.mee.2014.10.024

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Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates

Heinz, W., Robl, W., & Dehm, G. (2015). Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering, 137, 5-10. doi:10.1016/j.mee.2014.10.024.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0026-AD2B-4 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0028-2ECF-E

Genre: Journal Article

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Creators:
Heinz, Walther¹, Author
Robl, Werner², Author
Dehm, Gerhard³, Author

Affiliations:
1Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, A-9524 Villach, Austria, ou_persistent22
2Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Published Online: 2014-11-07Date issued: 2015

Publication Status: Issued

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Identifiers: DOI: 10.1016/j.mee.2014.10.024

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Title: Microelectronic Engineering

Source Genre: Journal

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Publ. Info: Amsterdam : Elsevier

Pages: - Volume / Issue: 137 Sequence Number: - Start / End Page: 5 - 10 Identifier: ISSN: 0167-9317
CoNE: https://pure.mpg.de/cone/journals/resource/954925484690