Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu 
Films During Self-Annealing

Huang, Rui; Robl, Werner; Ceric, Hajdin; Detzel, Thomas; Dehm, Gerhard

doi:10.1109/TDMR.2009.2032768

Local TagsRelease HistoryDetailsSummary

Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

Huang, R., Robl, W., Ceric, H., Detzel, T., & Dehm, G. (2010). Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions, 10(1), 47-54. doi:10.1109/TDMR.2009.2032768.

Item is Released

show all hide all

Basic

show hide

Item Permalink: https://hdl.handle.net/21.11116/0000-0001-94F7-1 Version Permalink: https://hdl.handle.net/21.11116/0000-0001-9502-4

Genre: Journal Article

Files

show Files

Locators

show

Creators

show

hide

Creators:
Huang, Rui^{1, 2}, Author
Robl, Werner³, Author
Ceric, Hajdin⁴, Author
Detzel, Thomas⁵, Author
Dehm, Gerhard^{6, 7}, Author

Affiliations:
1Kompetenzzentrum Automobil-und Industrieelektronik (KAI) GmbH, Europastrasse 8, 9500 Villach, Austria, persistent22
2Institute for Microelectronics, Technische Universität Wien, 1040 Vienna, Austria, persistent22
3Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22
4Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, 1040 Vienna, Austria, persistent22
5Infineon Technologies Austria AG, A-9500 Villach, Austria, ou_persistent22
6Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22
7Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22

Content

show

Details

show

hide

Language(s): eng - English

Dates: Published Online: 2009-09-22Date issued: 2010-03

Publication Status: Issued

Pages: -

Publishing info: -

Table of Contents: -

Rev. Type: Peer

Identifiers: DOI: 10.1109/TDMR.2009.2032768

Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show

hide

Title: IEEE Transactions

Source Genre: Journal

Creator(s):

Affiliations:

Publ. Info: -

Pages: - Volume / Issue: 10 (1) Sequence Number: - Start / End Page: 47 - 54 Identifier: -