Mechanical characterization of copper thin ﬁlms produced by photolithography 
with a novel microscale high temperature loading rig

Arigela, Viswanadh Gowtham; Oellers, Tobias; Ludwig, A.; Kirchlechner, Christoph; Dehm, Gerhard

Lokale TagsFreigabegeschichteDetailsÜbersicht

Mechanical characterization of copper thin ﬁlms produced by photolithography with a novel microscale high temperature loading rig

Arigela, V. G., Oellers, T., Ludwig, A., Kirchlechner, C., & Dehm, G. (2018). Mechanical characterization of copper thin ﬁlms produced by photolithography with a novel microscale high temperature loading rig. Talk presented at The International Conference on Experimental Mechanics, (ICEM) 2018. Brussels, Belgium. 2018-07-01 - 2018-07-05.

Item is Freigegeben

einblenden: alle ausblenden: alle

Basisdaten

einblenden: ausblenden:

Datensatz-Permalink: https://hdl.handle.net/21.11116/0000-0005-4715-4 Versions-Permalink: https://hdl.handle.net/21.11116/0000-0005-4716-3

Genre: Vortrag

ausblenden:

Urheber:
Arigela, Viswanadh Gowtham¹, Autor
Oellers, Tobias², Autor
Ludwig, A.³, Autor
Kirchlechner, Christoph¹, Autor
Dehm, Gerhard⁴, Autor

Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
2Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22
3Chair for MEMS Materials, Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany und Materials Research Department, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22
4Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398