Computational simulation of cracking and buckling of thin metallic films on 
polymer substrate under tensile loading

Toth, Florian; Wiesinger, Andreas; Cordill, Megan Jo; Marx, Vera Maria; Rammerstorfer, Franz Georg

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Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading

Toth, F., Wiesinger, A., Cordill, M. J., Marx, V. M., & Rammerstorfer, F. G. (2014). Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading. Talk presented at "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben. Leoben, Austria. 2014-04-10 - 2014-04-11.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-A2A2-F Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0029-AE44-B

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Creators:
Toth, Florian¹, Author
Wiesinger, Andreas¹, Author
Cordill, Megan Jo², Author
Marx, Vera Maria³, Author
Rammerstorfer, Franz Georg⁴, Author

Affiliations:
1Institute of Lightweight Design and Structural Biomechanics, Vienna University of Technology, Gußhausstr. 27-29, Vienna, Austria, ou_persistent22
2Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22
3Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863399
4Department Material Physics, Montanuniversität Leoben, Jahnstr. 12, Leoben, Austria, ou_persistent22

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Language(s): eng - English

Dates: Created: 2014-04

Publication Status: Not specified

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Title: "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben

Place of Event: Leoben, Austria

Start-/End Date: 2014-04-10 - 2014-04-11

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