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  Wettability effects of immersion tin final finishes with lead-free solders

Hetschel, T., Wolter, K.-J., & Phillipp, F. (2008). Wettability effects of immersion tin final finishes with lead-free solders. In 2nd Electronics System-Integration Technology Conference (pp. 561-566). Piscataway, NJ: IEEE.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-41C8-0 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-41C9-E
Genre: Conference Paper

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 Creators:
Hetschel, T.1, Author
Wolter, K.-J.1, Author
Phillipp, F.2, Author           
Affiliations:
1Robert Bosch GmbH, Stuttgart, Germany;Electro. Packaging Lab.,Dresden University of Technology, Dresden, Germany, ou_persistent22              
2Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society, DE, ou_1497669              

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Free keywords: MPI für Metallforschung; Stuttgart Center for Electron Microscopy (StEM);
 Abstract: -

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Language(s): eng - English
 Dates: 2008
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 430141
 Degree: -

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Title: 2nd Electronics System-Integration Technology Conference
Place of Event: Greenwich, UK
Start-/End Date: 2008-09-01 - 2008-09-04

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Title: 2nd Electronics System-Integration Technology Conference
Source Genre: Proceedings
 Creator(s):
Affiliations:
Publ. Info: Piscataway, NJ : IEEE
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 561 - 566 Identifier: ISBN: 978-1-4244-2813-7