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  Effect of Process Parameters on the Microstructure and Properties of TiC Dispersion Strengthened Copper Alloys

Weißgärber, T., Sauer, C., Püsche, W., Kieback, B. F., Dehm, G., & Mayer, J. (1997). Effect of Process Parameters on the Microstructure and Properties of TiC Dispersion Strengthened Copper Alloys. In Advances in Powder Metallurgy and Particulate Materials - 1997 (pp. 1123-1134). Princeton NJ: Metal Powder Industries Federation; APMI International.

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 Creators:
Weißgärber, Thomas1, Author           
Sauer, Christa1, Author           
Püsche, Wolfgang1, Author           
Kieback, Bernd F.1, Author           
Dehm, Gerhard2, Author           
Mayer, Joachim3, Author           
Affiliations:
1Dresden University of Technology, Mommsenstr. 13, Dresden D-01062, Germany, persistent22              
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
3Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              

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Language(s): eng - English
 Dates: 1997
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: -
 Degree: -

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Title: International Conference on Powder Metallurgy and Particulate Materials 1997
Place of Event: Chicago, IL, USA
Start-/End Date: 1997-06-29 - 1997-07-02

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Title: Advances in Powder Metallurgy and Particulate Materials - 1997
Source Genre: Proceedings
 Creator(s):
Affiliations:
Publ. Info: Princeton NJ : Metal Powder Industries Federation; APMI International
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 1123 - 1134 Identifier: -