Influence of tantalum and silver interlayers on thermal stress evolution in 
copper thin films on silicon substrates

Schmidt, T. K.; Balk, T. J.; Dehm, G.; Arzt, E.

Local TagsRelease HistoryDetailsSummary

Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

Schmidt, T. K., Balk, T. J., Dehm, G., & Arzt, E. (2004). Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia, 50, 733-737.

Item is Released

show all hide all

Basic

show hide

Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-2BD6-9 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-2BD7-7

Genre: Journal Article

Files

show Files

Locators

show

Creators

show

hide

Creators:
Schmidt, T. K.^{1, 2}, Author
Balk, T. J.², Author
Dehm, G.², Author
Arzt, E.^{2, 3}, Author

Affiliations:
1Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655
3Universität Stuttgart, Institut für Metallkunde, ou_persistent22

Content

show

hide

Free keywords: MPI für Metallforschung; Abt. Arzt;

Abstract: -

Details

show

hide

Language(s): eng - English

Dates: Date issued: 2004

Publication Status: Issued

Pages: -

Publishing info: -

Table of Contents: -

Rev. Type: Peer

Identifiers: eDoc: 240275

Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show

hide

Title: Scripta Materialia

Source Genre: Journal

Creator(s):

Affiliations:

Publ. Info: -

Pages: - Volume / Issue: 50 Sequence Number: - Start / End Page: 733 - 737 Identifier: -