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  Failure mechanisms in metal-metal nanolaminates at elevated temperatures: Microcompression of Cu–W multilayers

Wheeler, J. M., Raghavan, R., Raghavan, R., Chawla, V., Zechner, J., Utke, I., et al. (2015). Failure mechanisms in metal-metal nanolaminates at elevated temperatures: Microcompression of Cu–W multilayers. Scripta Materialia, 98, 28-31. doi:10.1016/j.scriptamat.2014.11.007.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-002A-3ED9-8 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-002A-3EDB-4
Genre: Journal Article

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 Creators:
Wheeler, Jeffrey M.1, Author           
Raghavan, R.2, Author           
Raghavan, Rejin1, 2, Author           
Chawla, Vipin1, Author           
Zechner, Johannes1, Author           
Utke, Ivo1, Author           
Michler, Johann K.1, Author           
Affiliations:
1Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, Switzerland, ou_persistent22              
2Synthesis of Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863403              

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Free keywords: High temperature; Microcompression; Multilayer; Nanolaminate
 Abstract: Nanolaminates of Cu and W with a bilayer thickness ratio of 1:1 and individual layer thicknesses of 5, 20 and 100 nm were studied by using elevated temperature microcompression. Failure in all the multilayers with different interlayer thicknesses occurs by rupture of the W interlayers, resulting in local strain softening and shearing at ambient temperature and lateral plastic flow of the Cu layers confined between the harder W layers at lower stresses with increasing testing temperatures. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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Language(s): eng - English
 Dates: 2015-03-15
 Publication Status: Issued
 Pages: 4
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: ISI: 000348965500008
DOI: 10.1016/j.scriptamat.2014.11.007
 Degree: -

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Title: Scripta Materialia
Source Genre: Journal
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Publ. Info: Amsterdam : Elsevier B. V.
Pages: - Volume / Issue: 98 Sequence Number: - Start / End Page: 28 - 31 Identifier: ISSN: 1359-6462
CoNE: https://pure.mpg.de/cone/journals/resource/954926243506