Metalorganic chemical vapor deposition of silver thin films for future 
interconnects by direct liquid injection system

Gao, L.; Härter, P.; Linsmeier, C.; Gstöttner, J.; Emling, R.; Schmitt-Landsiedel, D.

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Metalorganic chemical vapor deposition of silver thin films for future interconnects by direct liquid injection system

Gao, L., Härter, P., Linsmeier, C., Gstöttner, J., Emling, R., & Schmitt-Landsiedel, D. (2004). Metalorganic chemical vapor deposition of silver thin films for future interconnects by direct liquid injection system. Materials Science in Semiconductor Processing, 7, 331-335. Retrieved from http://dx.doi.org/10.1016/j.mssp.2004.09.128.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-20E6-4 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-20E7-2

Genre: Journal Article

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Creators:
Gao, L.¹, Author
Härter, P.², Author
Linsmeier, C.³, Author
Gstöttner, J.², Author
Emling, R.², Author
Schmitt-Landsiedel, D.², Author

Affiliations:
1External Organizations, ou_persistent22
2Institute for Technical Electronics, Technical University Munich, Munich, Germany; Institute for Inorganic Chemistry, Technical University Munich, Munich, Germany, ou_persistent22
3Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856328

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Free keywords: E-MRS Spring Meeting 2004, Symposium C: New Materials in Future Silicon Technology, Strasbourg, 2004-05-24 to 2004-05-28

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Language(s): eng - English

Dates: Date issued: 2004

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 208500
URI: http://dx.doi.org/10.1016/j.mssp.2004.09.128

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Title: Materials Science in Semiconductor Processing

Source Genre: Journal

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Pages: - Volume / Issue: 7 Sequence Number: - Start / End Page: 331 - 335 Identifier: -