English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
 
 
DownloadE-Mail
 Local TagsRelease HistoryDetailsSummary
  Can micro-compression testing provide stress–strain data for thin films? A comparative study using Cu, VN, TiN and W coatings

Dehm, G., Wörgötter, H. P., Cazottes, S., Purswani, J. M., Gall, D., Mitterer, C., et al. (2009). Can micro-compression testing provide stress–strain data for thin films? A comparative study using Cu, VN, TiN and W coatings. Thin Solid Films, 518(5), 1517-1521. doi:10.1016/j.tsf.2009.09.070.

Item is

 

show all hide all

Basic

show hide
Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-4737-6 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-4738-4
Genre: Journal Article

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Dehm, Gerhard1, 2, Author           
Wörgötter, H. P.3, Author           
Cazottes, Sophie2, Author           
Purswani, J. M.4, Author           
Gall, Daniel4, Author           
Mitterer, Christian5, Author           
Kiener, Daniel6, Author           
Affiliations:
1Department Materialphysik, Montanuniversität Leoben, Austria, ou_persistent22              
2Erich Schmid Institute of Material Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              
3Materials Center Leoben, Forschungs GmbH, Leoben, Austria, ou_persistent22              
4Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA, ou_persistent22              
5Department of Physical Metallurgy and Materials Testing, Christian-Doppler Laboratory for Advanced Coatings, University of Leoben, Austria, ou_persistent22              
6Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Austria, ou_persistent22              

Content

show
hide
Free keywords: -
 Abstract: Micro-compression testing using an instrumented micro- or nanoindenter equipped with a flat punch is a promising approach to measure the stress–strain response of miniaturized materials and to complement hardness and modulus measurements gained by nanoindendation. Focussed ion beam milling is employed to fabricate micron-sized compression pillars from 1 μm thick single crystal Cu(001), TiN(001), and VN(001) films grown on MgO(001), and from a 6.7 μm thick polycrystalline W coating deposited on Si(001). In situ micro-compression tests in a scanning electron microscope reveal reproducible stress–strain curves for W, a considerable statistical scatter in the flow stress for Cu and VN, and failure of TiN pillars by cleavage. A linear work-hardening rate of 2.7±1.2 GPa is determined for the polycrystalline W coating. The results are critically discussed taking into account material defects and the stiffness of the film-substrate system.

Details

show
hide
Language(s): eng - English
 Dates: 2009-12-31
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: DOI: 10.1016/j.tsf.2009.09.070
 Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show
hide
Title: Thin Solid Films
  Abbreviation : Thin Solid Films
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: Lausanne, Switzerland, etc. : Elsevier
Pages: - Volume / Issue: 518 (5) Sequence Number: - Start / End Page: 1517 - 1521 Identifier: ISSN: 0040-6090
CoNE: https://pure.mpg.de/cone/journals/resource/954925449792