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  Non-destructive, real time in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new Scanning Kelvin Probe Blister Test

Grundmeier, G., Wapner, K., Schönberger, B., & Stratmann, M. (2004). Non-destructive, real time in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new Scanning Kelvin Probe Blister Test. Talk presented at Annual Meeting of the American Adhesion Society. Wilmington, UK. 2004-02-15 - 2004-02-20.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-6614-3 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-6616-0
Genre: Talk

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 Creators:
Grundmeier, G.1, 2, Author           
Wapner, K.1, Author           
Schönberger, B.3, Author           
Stratmann, M.3, Author           
Affiliations:
1Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863349              
2Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863353              
3Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863348              

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 Identifiers: eDoc: 206575
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Title: Annual Meeting of the American Adhesion Society
Place of Event: Wilmington, UK
Start-/End Date: 2004-02-15 - 2004-02-20

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