High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys

Sauer, Christa; Weißgärber, Thomas; Püsche, Wolfgang; Dehm, Gerhard; Mayer, Joachim; Kieback, Bernd F.

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High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys

Sauer, C., Weißgärber, T., Püsche, W., Dehm, G., Mayer, J., & Kieback, B. F. (1997). High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys. International Journal of Powder Metallurgy, 33(1), 45-53.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-957D-B Version Permalink: https://hdl.handle.net/21.11116/0000-0001-9585-0

Genre: Journal Article

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Creators:
Sauer, Christa¹, Author
Weißgärber, Thomas¹, Author
Püsche, Wolfgang¹, Author
Dehm, Gerhard², Author
Mayer, Joachim³, Author
Kieback, Bernd F.¹, Author

Affiliations:
1Dresden University of Technology, Mommsenstr. 13, Dresden D-01062, Germany, persistent22
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655
3Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657

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Language(s): eng - English

Dates: Date issued: 1997-01

Publication Status: Issued

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Title: International Journal of Powder Metallurgy

Abbreviation : Int. J. Powder Metallurg.

Source Genre: Journal

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Publ. Info: Princeton, NJ, USA : American Powder Metallurgy Institute International

Pages: - Volume / Issue: 33 (1) Sequence Number: - Start / End Page: 45 - 53 Identifier: ISSN: 0888-7462
CoNE: https://pure.mpg.de/cone/journals/resource/0888-7462