Microstructure and adhesion of as-deposited and annealed Cu/Ti films on 
polyimide

Cordill, Megan Jo; Taylor, Aidan Arthur; Schalko, Johannes; Dehm, Gerhard

doi:10.3139/146.110513

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Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

Cordill, M. J., Taylor, A. A., Schalko, J., & Dehm, G. (2011). Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. International Journal of Materials Research, 102(6), 729-734. doi:10.3139/146.110513.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-9079-4 Version Permalink: https://hdl.handle.net/21.11116/0000-0001-9087-3

Genre: Journal Article

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Creators:
Cordill, Megan Jo^{1, 2}, Author
Taylor, Aidan Arthur², Author
Schalko, Johannes³, Author
Dehm, Gerhard^{4, 5}, Author

Affiliations:
1Department Materials Physics, Montanuniversitt Leoben, Jahnstrae 12, A-8700 Leoben, Austria, ou_persistent22
2Erich Schmid Institute of Materials Science, Austrian Academy of Sciences and Department Material Physics, University of Leoben, JahnstraGe 12, A-8700 Leoben, Austria, ou_persistent22
3Institute for Integrated Sensor Systems, Austrian Academy of Sciences, Wiener Neustadt, Austria, persistent22
4Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22
5Erich Schmid Institute of Material Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22

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Language(s): eng - English

Dates: Date issued: 2011-06

Publication Status: Issued

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Rev. Type: Peer

Identifiers: DOI: 10.3139/146.110513

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Title: International Journal of Materials Research

Abbreviation : Int. J. Mat. Res.

Source Genre: Journal

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Pages: - Volume / Issue: 102 (6) Sequence Number: - Start / End Page: 729 - 734 Identifier: ISSN: 1862-5282
CoNE: https://pure.mpg.de/cone/journals/resource/954925453910