Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, Bastian; Schießl, Andreas; Schingale, Angelika; Dehm, Gerhard

Local TagsRelease HistoryDetailsSummary

Micromechanical investigation of lead-free solder joints in microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2014). Micromechanical investigation of lead-free solder joints in microelectronics. Talk presented at TMS 2014. San Diego, CA, USA. 2014-02-16 - 2014-02-20.

Item is Released

show all hide all

Basic

show hide

Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C367-D Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C36A-7

Genre: Talk

Files

show Files

Locators

show

Creators

show

hide

Creators:
Philippi, Bastian^{1, 2}, Author
Schießl, Andreas³, Author
Schingale, Angelika³, Author
Dehm, Gerhard¹, Author

Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398
2Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria, ou_persistent22
3Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22

Content

show

Details

show

hide

Language(s): eng - English

Dates: Created: 2014

Publication Status: Not specified

Pages: -

Publishing info: -

Table of Contents: -

Rev. Type: -

Identifiers: -

Degree: -

Event

show

hide

Title: TMS 2014

Place of Event: San Diego, CA, USA

Start-/End Date: 2014-02-16 - 2014-02-20

Legal Case

show

Project information

show

Source

show