Disparate tendency of stress evolution of thin and thick electroplated Cu films 
at room temperature

Huang, Rui; Robl, Werner; Dehm, Gerhard; Ceric, Hajdin; Detzel, Thomas

doi:10.1109/IPFA.2010.5532222

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Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature

Huang, R., Robl, W., Dehm, G., Ceric, H., & Detzel, T. (2010). Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 1-6). IEEE.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-002E-7D79-7 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-002E-7D7A-5

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Creators:
Huang, Rui¹, Author
Robl, Werner², Author
Dehm, Gerhard³, Author
Ceric, Hajdin⁴, Author
Detzel, Thomas⁵, Author

Affiliations:
1Kompetenzzentrum Automobil-und Industrieelektronik (KAI) GmbH, Europastrasse 8, 9500 Villach, Austria, persistent22
2Infineon Technologies Germany AG, D-93049 Regensburg, Germany, ou_persistent22
3Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22
4Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, 1040 Vienna, Austria, persistent22
5Infineon Technologies Austria AG, A-9500 Villach, Austria, ou_persistent22

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Language(s): eng - English

Dates: Date issued: 2010-07-29

Publication Status: Issued

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Identifiers: DOI: 10.1109/IPFA.2010.5532222

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Title: International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2010

Place of Event: Singapore, Singapore

Start-/End Date: 2010-07-05 - 2010-07-09

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Title: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits

Source Genre: Proceedings

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Publ. Info: IEEE

Pages: - Volume / Issue: - Sequence Number: 5532222 Start / End Page: 1 - 6 Identifier: -