Effects of thin film Nb interlayer in Cu/sapphire bonds

Liu, W. P.; Elssner, G.; Rühle, M.

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Effects of thin film Nb interlayer in Cu/sapphire bonds

Liu, W. P., Elssner, G., & Rühle, M. (2001). Effects of thin film Nb interlayer in Cu/sapphire bonds. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 317(1-2 Sp. Iss. SI), 153-162.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-33FA-F Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-33FB-D

Genre: Journal Article

Alternative Title : Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.

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Creators:
Liu, W. P.¹, Author
Elssner, G.^{2, 3}, Author
Rühle, M.², Author

Affiliations:
1Dalian Inst Railway Technol, Dept Mat Sci & Engn, Dalian; 116028, Peoples R China; Dalian Inst Railway Technol, Dept Mat Sci & Engn, Dalian 116028, Peoples R China;, ou_persistent22
2Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657
3Former Central Scientific Facility Metallography, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497652

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Free keywords: MPI für Metallforschung; Abt. Rühle; thin film Nb interlayer; Cu/sapphire diffusion bonds; Cu/Al2O3 bond strength improvement

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Language(s): eng - English

Dates: Date issued: 2001-10-31

Publication Status: Issued

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Rev. Type: Peer

Identifiers: eDoc: 20450
ISI: 000171269400024

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Title: Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing

Alternative Title : Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.

Source Genre: Journal

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Pages: - Volume / Issue: 317 (1-2 Sp. Iss. SI) Sequence Number: - Start / End Page: 153 - 162 Identifier: ISSN: 0921-5093