Dislocation slip transfer at Cu grain boundaries analyzed by µLaue diffraction

Malyar, Nataliya; Micha, Jean-Sebastien; Dehm, Gerhard; Kirchlechner, Christoph

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Dislocation slip transfer at Cu grain boundaries analyzed by µLaue diffraction

Malyar, N., Micha, J.-S., Dehm, G., & Kirchlechner, C. (2016). Dislocation slip transfer at Cu grain boundaries analyzed by µLaue diffraction. Poster presented at Gordon Research Seminar Thin Film & Small Scale Mechanical Behavior, Lewiston, ME, USA.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-002B-B772-2 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-002B-B773-F

Genre: Poster

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Creators:
Malyar, Nataliya¹, Author
Micha, Jean-Sebastien², Author
Dehm, Gerhard³, Author
Kirchlechner, Christoph¹, Author

Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
2CNRS, CEA CRG IF Beamline ESRF BM32, F-38043 Grenoble 9, France, ou_persistent22
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Created: 2016-07

Publication Status: Not specified

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Title: Gordon Research Seminar Thin Film & Small Scale Mechanical Behavior

Place of Event: Lewiston, ME, USA

Start-/End Date: 2016-07-23 - 2016-07-24

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