Microscopic investigation of strain localization and fatigue damage in thin Cu 
films

Zhang, G. P.; Volkert, C. A.; Schwaiger, R.; Kraft, O.

Local TagsRelease HistoryDetailsSummary

Microscopic investigation of strain localization and fatigue damage in thin Cu films

Zhang, G. P., Volkert, C. A., Schwaiger, R., & Kraft, O. (2005). Microscopic investigation of strain localization and fatigue damage in thin Cu films. Materials Science Forum, 475-479, 3647-3650.

Item is Released

show all hide all

Basic

show hide

Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-265E-5 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-265F-3

Genre: Journal Article

Files

show Files

Locators

show

Creators

show

hide

Creators:
Zhang, G. P.¹, Author
Volkert, C. A.¹, Author
Schwaiger, R.¹, Author
Kraft, O.¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

Content

show

hide

Free keywords: MPI für Metallforschung; Abt. Arzt;

Abstract: -

Details

show

hide

Language(s): eng - English

Dates: Date issued: 2005-09-14

Publication Status: Issued

Pages: -

Publishing info: -

Table of Contents: -

Rev. Type: Peer

Identifiers: eDoc: 240396

Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show

hide

Title: Materials Science Forum

Source Genre: Journal

Creator(s):

Affiliations:

Publ. Info: -

Pages: - Volume / Issue: 475-479 Sequence Number: - Start / End Page: 3647 - 3650 Identifier: -