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  Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

Schmidt, T. K., Balk, T. J., Dehm, G., & Arzt, E. (2004). Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia, 50, 733-737.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0010-2BD6-9 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0010-2BD7-7
Genre: Journal Article

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 Creators:
Schmidt, T. K.1, 2, Author              
Balk, T. J.2, Author              
Dehm, G.2, Author              
Arzt, E.2, 3, Author              
Affiliations:
1Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
3Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt;
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Language(s): eng - English
 Dates: 2004
 Publication Status: Published in print
 Pages: -
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 Table of Contents: -
 Rev. Method: Peer
 Identifiers: eDoc: 240275
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Title: Scripta Materialia
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: -
Pages: - Volume / Issue: 50 Sequence Number: - Start / End Page: 733 - 737 Identifier: -