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  Investigation of Electromigration in Copper Interconnects by Noise Measurements

Emelianov, V., Ganesan, G., Puzic, A., Schulz, S., Eizenberg, M., Habermeier, H.-U., et al. (2003). Investigation of Electromigration in Copper Interconnects by Noise Measurements. In M. B. Weissmann, N. E. Israeloff, & A. S. Kogan (Eds.), Noise as a Tool for Studying Materials (pp. 271-281).

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0010-2EB1-5 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-BEA6-3
Genre: Conference Paper

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 Creators:
Emelianov, V., Author
Ganesan, G., Author
Puzic, A.1, Author              
Schulz, S., Author              
Eizenberg, M., Author
Habermeier, H.-U.2, Author
Stoll, H.1, 3, Author              
Affiliations:
1Dept. Modern Magnetic Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497648              
2Max Planck Society, ou_persistent13              
3Former Central Scientific Facility ANKA Synchroton Beamline, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497651              

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Free keywords: MPI für Metallforschung; MPI für Festkörperforschung; Abt. Schütz;
 Abstract: -

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Language(s): eng - English
 Dates: 2003
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 63712
 Degree: -

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Title: Noise as a Tool for Studying Materials
Place of Event: Santa Fe, New Mexico
Start-/End Date: 2003-06-02 - 2003-06-04

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Source 1

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Title: Noise as a Tool for Studying Materials
Source Genre: Proceedings
 Creator(s):
Weissmann, M. B., Editor
Israeloff, N. E., Editor
Kogan, A. S., Editor
Affiliations:
-
Publ. Info: -
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 271 - 281 Identifier: -

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Title: Proceedings of SPIE
Source Genre: Series
 Creator(s):
SPIE, the International Society for Optical Engineering, Editor              
Affiliations:
-
Publ. Info: -
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: - Identifier: -