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  Bonding between Cu and α-Al2O3

Gao, M., Scheu, C., Wagner, T., Kurtz, W., & Rühle, M. (2002). Bonding between Cu and α-Al2O3. Zeitschrift für Metallkunde, 93(5), 438-443.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3168-7 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3169-5
Genre: Journal Article
Alternative Title : Z. Metallk.

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08-ar_2002.pdf (Abstract), 65KB
 
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 Creators:
Gao, M.1, Author           
Scheu, C.1, Author           
Wagner, T.2, Author           
Kurtz, W.1, Author           
Rühle, M.1, Author           
Affiliations:
1Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              
2Central Scientific Facility Thin Film Laboratory, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497640              

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Free keywords: MPI für Metallforschung; Abt. Rühle; Abt. Arzt; ZWE Dünnschichtlabor; Cu/alpha-Al2O3 interfaces; alpha-Al2O3 surface preparation; electron energy-loss spectroscopy; transmission electron microscopy
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Language(s): eng - English
 Dates: 2002-05
 Publication Status: Issued
 Pages: -
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 Rev. Type: Peer
 Identifiers: eDoc: 6785
ISI: 000176310600014
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Title: Zeitschrift für Metallkunde
  Alternative Title : Z. Metallk.
Source Genre: Journal
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Pages: - Volume / Issue: 93 (5) Sequence Number: - Start / End Page: 438 - 443 Identifier: ISSN: 0044-3093