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  In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate

Dehm, G., Weiss, D., & Arzt, E. (2001). In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 309-310, 468-472.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3492-D Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-3493-B
Genre: Journal Article
Alternative Title : Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.

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 Creators:
Dehm, G.1, Author           
Weiss, D.1, Author           
Arzt, E.1, 2, Author           
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2Universität Stuttgart, Institut für Metallkunde, ou_persistent22              

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Free keywords: MPI für Metallforschung; Abt. Arzt; thin film plasticity; dislocation; interface; in situ TEM; thermal stress; Cu film
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Language(s): eng - English
 Dates: 2001-07-15
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 21054
ISI: 000169044600093
 Degree: -

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Title: Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing
  Alternative Title : Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: -
Pages: - Volume / Issue: 309-310 Sequence Number: - Start / End Page: 468 - 472 Identifier: ISSN: 0921-5093