English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
 
 
DownloadE-Mail
 Local TagsRelease HistoryDetailsSummary
  The microstructure and state of stress of Sn thin films after post-plating annealing; an explanation for the suppression of whisker formation?

Sobiech, M., Welzel, U., Schuster, R., Mittemeijer, E. J., Hügel, W., Seekamp, A., et al. (2007). The microstructure and state of stress of Sn thin films after post-plating annealing; an explanation for the suppression of whisker formation? In R. Bonda (Ed.), 2007 IEEE Electronic Components & Technology Conference, ECTC '07. Proceedings (pp. 192-197). Piscataway, NJ: IEEE Service Center.

Item is

 

show all hide all

Basic

show hide
Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-43EC-C Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0010-43ED-A
Genre: Conference Paper

Files

show Files
hide Files
:
501.pdf (Abstract), 15KB
 
File Permalink:
-
Name:
501.pdf
Description:
-
OA-Status:
Visibility:
Restricted (Max Planck Institute for Intelligent Systems, MSMT; )
MIME-Type / Checksum:
application/pdf
Technical Metadata:
Copyright Date:
-
Copyright Info:
eDoc_access: INSTITUT
License:
-

Locators

show

Creators

show
hide
 Creators:
Sobiech, M.1, Author           
Welzel, U.1, Author           
Schuster, R.1, Author           
Mittemeijer, E. J.1, 2, Author           
Hügel, W., Author
Seekamp, A., Author
Müller, V., Author
Affiliations:
1Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497644              
2Universität Stuttgart, Institut für Materialwissenschaft, ou_persistent22              

Content

show
hide
Free keywords: MPI für Metallforschung; Abt. Mittemeijer;
 Abstract: -

Details

show
hide
Language(s): eng - English
 Dates: 2007
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 319234
 Degree: -

Event

show
hide
Title: 57th IEEE Electronic Components and Technology Conference
Place of Event: Reno, Nevada [USA]
Start-/End Date: 2007-05-29 - 2007-06-01

Legal Case

show

Project information

show

Source 1

show
hide
Title: 2007 IEEE Electronic Components & Technology Conference, ECTC '07. Proceedings
Source Genre: Proceedings
 Creator(s):
Bonda, R., Editor
Affiliations:
-
Publ. Info: Piscataway, NJ : IEEE Service Center
Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 192 - 197 Identifier: ISBN: 1-4244-0985-3