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  Adhesion behavior of Cu–Cr thin films on polyimide substrate

Marx, V. M., Kirchlechner, C., Zizak, I., Cordill, M. J., & Dehm, G. (2013). Adhesion behavior of Cu–Cr thin films on polyimide substrate. Poster presented at ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal.

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 Creators:
Marx, Vera Maria1, Author              
Kirchlechner, Christoph2, Author              
Zizak, Ivo3, Author              
Cordill, Megan Jo4, Author              
Dehm, Gerhard5, Author              
Affiliations:
1Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863399              
2Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
3Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              
4Department Materials Physics, Montanuniversitt Leoben, Jahnstrae 12, A-8700 Leoben, Austria, ou_persistent22              
5Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Free keywords: Best Poster Award - 1st place
 Abstract: -

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Language(s): eng - English
 Dates: 2013-10
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 681729
 Degree: -

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Title: ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV"
Place of Event: Olhão, Portugal
Start-/End Date: 2013-10-06 - 2013-10-11

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