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  Micromechanical investigation of solder joints in automotive microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2013). Micromechanical investigation of solder joints in automotive microelectronics. Poster presented at GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-2290-0 Version Permalink: http://hdl.handle.net/21.11116/0000-0002-8DB5-3
Genre: Poster

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 Creators:
Philippi, B.1, Author              
Schießl, A., Author
Schingale, A., Author
Dehm, G.1, 2, Author              
Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              

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Language(s): eng - English
 Dates: 2013-07
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: eDoc: 669364
 Degree: -

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Title: GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE
Place of Event: Düsseldorf, Germany
Start-/End Date: 2013-07-18 - 2013-07-19

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