Micromechanical investigation of solder joints in automotive microelectronics

Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.

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Micromechanical investigation of solder joints in automotive microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2013). Micromechanical investigation of solder joints in automotive microelectronics. Poster presented at GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany.

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Datensatz-Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-2290-0 Versions-Permalink: https://hdl.handle.net/21.11116/0000-0002-8DB5-3

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Urheber:
Philippi, B.¹, Autor
Schießl, A., Autor
Schingale, A., Autor
Dehm, G.^{1, 2}, Autor

Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398
2Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655