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  Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate

Marx, V. M., Kirchlechner, C., Zizak, I., Cordill, M. J., & Dehm, G. (2013). Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. Poster presented at TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-24CC-9 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0027-D2CF-5
Genre: Poster

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 Creators:
Marx, V. M.1, Author              
Kirchlechner, C.2, Author              
Zizak, I., Author
Cordill, M. J., Author
Dehm, G.1, 3, Author              
Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              
2Nano-/Micromechanics of Materials, Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
3Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              

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Language(s): eng - English
 Dates: 2013
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: eDoc: 655287
 Degree: -

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Title: TMS 2013: 142nd Annual Meeting & Exhibition
Place of Event: San Antonio, TX, USA
Start-/End Date: 2013-03-03 - 2013-03-07

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