Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate

Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.

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Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate

Marx, V. M., Kirchlechner, C., Zizak, I., Cordill, M. J., & Dehm, G. (2013). Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. Poster presented at TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-24CC-9 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0027-D2CF-5

Genre: Poster

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Creators:
Marx, V. M.¹, Author
Kirchlechner, C.², Author
Zizak, I., Author
Cordill, M. J., Author
Dehm, G.^{1, 3}, Author

Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398
2Nano-/Micromechanics of Materials, Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
3Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655

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Language(s): eng - English

Dates: Created: 2013

Publication Status: Not specified

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Identifiers: eDoc: 655287

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Title: TMS 2013: 142nd Annual Meeting & Exhibition

Place of Event: San Antonio, TX, USA

Start-/End Date: 2013-03-03 - 2013-03-07

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