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  The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces

Gründer, Y., Renner, F. U., & Lee, T. L. (2009). The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces. Surface Science, 603(17), L105-L108.

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Gründer, Y., Author
Renner, F. U.1, Author              
Lee,, T. L., Author
Affiliations:
1Interface Structures and High-Temperature Reactions, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society

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Language(s): eng - English
 Dates: 2009-09-01
 Publication Status: Published in print
 Pages: -
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 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 452616
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Title: Surface Science
Source Genre: Journal
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Pages: - Volume / Issue: 603 (17) Sequence Number: - Start / End Page: L105 - L108 Identifier: -