English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
  Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures

Blum, W., Li, Y. J., & Durst, K. (2009). Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures. Acta Materialia, 57, 5207-5217.

Item is

Basic

show hide
Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-4445-0 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-4447-C
Genre: Journal Article

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Blum, W., Author
Li, Y. J.1, 2, Author              
Durst, K., Author
Affiliations:
1Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863384              
2Theory and Simulation, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863392              

Content

show

Details

show
hide
Language(s): eng - English
 Dates: 2009
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 493346
 Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show
hide
Title: Acta Materialia
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: -
Pages: - Volume / Issue: 57 Sequence Number: - Start / End Page: 5207 - 5217 Identifier: -