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  3 Dimensional EBSD study of the relationship between triple junctions and columnar grain in electrodeposited materials

Bastos, A., Zaefferer, S., & Raabe, D. (2007). 3 Dimensional EBSD study of the relationship between triple junctions and columnar grain in electrodeposited materials. Poster presented at Electron Back Scatter Diffraction Meeting 2007, New Lanark, Scotland, UK.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-5317-0 Version Permalink: http://hdl.handle.net/21.11116/0000-0002-91DD-1
Genre: Poster

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 Creators:
Bastos, A., Author
Zaefferer, S.1, Author              
Raabe, D.2, Author              
Affiliations:
1Microscopy and Diffraction, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863391              
2Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863381              

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Language(s): eng - English
 Dates: 2007-03
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 317927
 Degree: -

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Title: Electron Back Scatter Diffraction Meeting 2007
Place of Event: New Lanark, Scotland, UK
Start-/End Date: 2007-03-26 - 2007-03-28

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