3 Dimensional EBSD study of the relationship between triple junctions and 
columnar grain in electrodeposited materials

Bastos, A.; Zaefferer, S.; Raabe, D.

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3 Dimensional EBSD study of the relationship between triple junctions and columnar grain in electrodeposited materials

Bastos, A., Zaefferer, S., & Raabe, D. (2007). 3 Dimensional EBSD study of the relationship between triple junctions and columnar grain in electrodeposited materials. Poster presented at Electron Back Scatter Diffraction Meeting 2007, New Lanark, Scotland, UK.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-5317-0 Version Permalink: https://hdl.handle.net/21.11116/0000-0002-91DD-1

Genre: Poster

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Creators:
Bastos, A., Author
Zaefferer, S.¹, Author
Raabe, D.², Author

Affiliations:
1Microscopy and Diffraction, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863391
2Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863381

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Language(s): eng - English

Dates: Created: 2007-03

Publication Status: Not specified

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Identifiers: eDoc: 317927

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Title: Electron Back Scatter Diffraction Meeting 2007

Place of Event: New Lanark, Scotland, UK

Start-/End Date: 2007-03-26 - 2007-03-28

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