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  Potassium Sorbate Solutions as Copper Chemical Mechanical Planarization (CMP) Based Slurries

Abelev, E., Smith, A. J., Hassel, A. W., & Ein-Eli, Y. (2007). Potassium Sorbate Solutions as Copper Chemical Mechanical Planarization (CMP) Based Slurries. Electrochim. Acta, 52, 5150-5158.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-5438-2 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-543A-D
Genre: Journal Article

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 Creators:
Abelev, E., Author
Smith, A. J.1, Author              
Hassel, A. W.1, Author              
Ein-Eli, Y., Author
Affiliations:
1Electrochemistry and Corrosion, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863355              

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 Dates: 2007
 Publication Status: Published in print
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 Identifiers: eDoc: 288965
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Title: Electrochim. Acta
Source Genre: Journal
 Creator(s):
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Publ. Info: -
Pages: - Volume / Issue: 52 Sequence Number: - Start / End Page: 5150 - 5158 Identifier: -