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  Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load

Klimow, G., Wapner, K., & Grundmeier, G. (2006). Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load. Poster presented at 3rd World Congress on Adhesion and Related Phenomena, WCARP-III, Beijing, China.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-5718-1 Version Permalink: http://hdl.handle.net/21.11116/0000-0002-91AC-8
Genre: Poster

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 Creators:
Klimow, G.1, Author              
Wapner, K.1, Author              
Grundmeier, G.1, 2, Author              
Affiliations:
1Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863349              
2Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863353              

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Language(s): eng - English
 Dates: 2006-10
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 288712
 Degree: -

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Title: 3rd World Congress on Adhesion and Related Phenomena, WCARP-III
Place of Event: Beijing, China
Start-/End Date: 2006-10-15 - 2006-10-18

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