Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal 
Interfaces under Corrosive and Mechanical Load

Klimow, G.; Wapner, K.; Grundmeier, G.

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Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load

Klimow, G., Wapner, K., & Grundmeier, G. (2006). Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load. Poster presented at 3rd World Congress on Adhesion and Related Phenomena, WCARP-III, Beijing, China.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-5718-1 Version Permalink: https://hdl.handle.net/21.11116/0000-0002-91AC-8

Genre: Poster

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Creators:
Klimow, G.¹, Author
Wapner, K.¹, Author
Grundmeier, G.^{1, 2}, Author

Affiliations:
1Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863349
2Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863353

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Language(s): eng - English

Dates: Created: 2006-10

Publication Status: Not specified

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Identifiers: eDoc: 288712

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Title: 3rd World Congress on Adhesion and Related Phenomena, WCARP-III

Place of Event: Beijing, China

Start-/End Date: 2006-10-15 - 2006-10-18

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