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  Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load

Klimow, G., Wapner, K., & Grundmeier, G. (n.d.). Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load. In Proceedings of the 3rd World Congress on Adhesion and Related Phenomena WCARP-III, Beijing/China (2006) (pp. 447-451).

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 Creators:
Klimow, G.1, Author              
Wapner, K.1, Author              
Grundmeier, G.1, 2, Author              
Affiliations:
1Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863349              
2Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863353              

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 Identifiers: eDoc: 377808
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Title: 3rd World Congress on Adhesion and Related Phenomena, WCARP-III
Place of Event: Beijing, China
Start-/End Date: 2006-10-15 - 2006-10-18

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Title: Proceedings of the 3rd World Congress on Adhesion and Related Phenomena WCARP-III, Beijing/China (2006)
Source Genre: Proceedings
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Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 447 - 451 Identifier: -