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  Non-destructive, In-Situ Measurement of De-Adhesion Processes at Buried Adhesive/Metal Interfaces by Means of a New Scanning Kelvin Probe Blister Test

Wapner, K., Stratmann, M., & Grundmeier, G. (2005). Non-destructive, In-Situ Measurement of De-Adhesion Processes at Buried Adhesive/Metal Interfaces by Means of a New Scanning Kelvin Probe Blister Test. Poster presented at EUROMAT 2005, Prague, Czech Republic.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-5E99-5 Version Permalink: http://hdl.handle.net/21.11116/0000-0002-8EFB-4
Genre: Poster

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 Creators:
Wapner, K.1, Author              
Stratmann, M.2, Author              
Grundmeier, G.1, 3, Author              
Affiliations:
1Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863349              
2Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863348              
3Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863353              

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 Dates: 2005-09
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: eDoc: 244948
 Degree: -

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Title: EUROMAT 2005
Place of Event: Prague, Czech Republic
Start-/End Date: 2005-09-04 - 2005-09-09

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