English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
  Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces

Wapner, K., & Grundmeier, G. (2004). Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces. Talk presented at Annual Meeting of the American Adhesion Society. Wilmington, UK. 2004-02-15 - 2004-02-20.

Item is

Basic

show hide
Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-6618-C Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-661A-8
Genre: Talk

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Wapner, K.1, Author              
Grundmeier, G.1, 2, Author              
Affiliations:
1Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863349              
2Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863353              

Content

show

Details

show
hide
Language(s):
 Dates:
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: eDoc: 206576
 Degree: -

Event

show
hide
Title: Annual Meeting of the American Adhesion Society
Place of Event: Wilmington, UK
Start-/End Date: 2004-02-15 - 2004-02-20

Legal Case

show

Project information

show

Source

show