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  Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces

Wapner, K., & Grundmeier, G. (2004). Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces. Talk presented at Annual Meeting of the American Adhesion Society. Wilmington, UK. 2004-02-15 - 2004-02-20.

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 Creators:
Wapner, K.1, Author           
Grundmeier, G.1, 2, Author           
Affiliations:
1Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863349              
2Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863353              

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 Publication Status: Not specified
 Pages: -
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 Identifiers: eDoc: 206576
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Title: Annual Meeting of the American Adhesion Society
Place of Event: Wilmington, UK
Start-/End Date: 2004-02-15 - 2004-02-20

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