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  New adhesion promoters for copper leadframes and epoxy resin

Müller, R., Heckmann, K., Habermann, M., Paul, T., & Stratmann, M. (2000). New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion, 72: 1, pp. 65-83.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-71D4-B Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0019-71D6-7
Genre: Journal Article

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 Creators:
Müller, R., Author
Heckmann, K., Author
Habermann, M., Author
Paul, T., Author
Stratmann, M.1, Author              
Affiliations:
1Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863348              

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Language(s): eng - English
 Dates: 2000
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: eDoc: 225207
 Degree: -

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Title: Journal of Adhesion
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: -
Pages: - Volume / Issue: 72 Sequence Number: 1 Start / End Page: 65 - 83 Identifier: -