New adhesion promoters for copper leadframes and epoxy resin

Müller, Rainer; Heckmann, Klaus; Habermann, Manfred; Paul, Thomas; Stratmann, Martin

doi:10.1080/00218460008029268

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New adhesion promoters for copper leadframes and epoxy resin

Müller, R., Heckmann, K., Habermann, M., Paul, T., & Stratmann, M. (2000). New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion, 72(1), 65-83. doi:10.1080/00218460008029268.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0019-71D4-B Version Permalink: https://hdl.handle.net/21.11116/0000-0008-386B-2

Genre: Journal Article

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Creators:
Müller, Rainer¹, Author
Heckmann, Klaus¹, Author
Habermann, Manfred², Author
Paul, Thomas², Author
Stratmann, Martin³, Author

Affiliations:
1Universität Regensburg, Labor für Grenzflächenchemie, Postfach 10104, D-93040 Regensburg, Germany, ou_persistent22
2Universität Erlangen-Nürnberg, Lehrstuhl für Korrosion und Oberflächentechnik, Martensstr. 7, D-98058 Erlangen, Germany, ou_persistent22
3Institut für Werkstoffwissenschaften IV, Universität Erlangen, Erlangen, D-91058, Germany, ou_persistent22

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Language(s): eng - English

Dates: Published Online: 2000-09-23Date issued: 2000

Publication Status: Issued

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Rev. Type: Peer

Identifiers: DOI: 10.1080/00218460008029268

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Title: Journal of Adhesion

Source Genre: Journal

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Publ. Info: London : Gordon and Breach

Pages: - Volume / Issue: 72 (1) Sequence Number: - Start / End Page: 65 - 83 Identifier: ISSN: 0021-8464
CoNE: https://pure.mpg.de/cone/journals/resource/954925409798