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  Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates

Sauter, L. X., Balk, T. J., Dehm, G., Nucci, J., & Arzt, E. (2005). Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates. Materials Research Society Symposium Proceedings, 875: O5.2, pp. 177-182.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0024-474B-9 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0024-474D-5
Genre: Journal Article

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 Creators:
Sauter, Linda Xenia1, Author              
Balk, Thomas John2, Author              
Dehm, Gerhard3, Author              
Nucci, Julie1, Author              
Arzt, Eduard1, Author              
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2University of Kentucky, Department of Chemical and Materials Engineering, Lexington, USA, ou_persistent22              
3Erich Schmid Institute of Material Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              

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Language(s): eng - English
 Dates: 2005
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: 2005 Materials Research Society Spring Meeting; San Francisco, CA; United States; 28 March 2005 through 1 April 2005; Code 66359
 Rev. Method: -
 Identifiers: -
 Degree: -

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Title: Materials Research Society Symposium Proceedings
Source Genre: Journal
 Creator(s):
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Publ. Info: New York : North Holland
Pages: - Volume / Issue: 875 Sequence Number: O5.2 Start / End Page: 177 - 182 Identifier: ISSN: 0272-9172
CoNE: /journals/resource/110978978378769