Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates

Sauter, Linda Xenia; Balk, Thomas John; Dehm, Gerhard; Nucci, Julie; Arzt, Eduard

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Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates

Sauter, L. X., Balk, T. J., Dehm, G., Nucci, J., & Arzt, E. (2005). Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates. Materials Research Society Symposium Proceedings, 875: O5.2, pp. 177-182.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-474B-9 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-474D-5

Genre: Journal Article

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Creators:
Sauter, Linda Xenia¹, Author
Balk, Thomas John², Author
Dehm, Gerhard³, Author
Nucci, Julie¹, Author
Arzt, Eduard¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655
2University of Kentucky, Department of Chemical and Materials Engineering, Lexington, USA, ou_persistent22
3Erich Schmid Institute of Material Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22

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Language(s): eng - English

Dates: Date issued: 2005

Publication Status: Issued

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Table of Contents: 2005 Materials Research Society Spring Meeting; San Francisco, CA; United States; 28 March 2005 through 1 April 2005; Code 66359

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Title: Materials Research Society Symposium Proceedings

Source Genre: Journal

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Publ. Info: New York : North Holland

Pages: - Volume / Issue: 875 Sequence Number: O5.2 Start / End Page: 177 - 182 Identifier: ISSN: 0272-9172
CoNE: https://pure.mpg.de/cone/journals/resource/110978978378769