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  Passivation Effects in Copper Thin Films

Wiederhirn, G., Balk, T. J., Dehm, G., Nucci, J. A., Richter, G., & Arzt, E. (2006). Passivation Effects in Copper Thin Films. AIP Conference Proceedings, 817, 185-191.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-0024-51AE-B Version Permalink: http://hdl.handle.net/11858/00-001M-0000-0024-51AF-9
Genre: Conference Paper

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 Creators:
Wiederhirn, Guillaume1, Author              
Balk, Thomas John2, Author              
Dehm, Gerhard3, Author              
Nucci, Julie A.1, Author              
Richter, Gunther4, Author              
Arzt, Eduard1, Author              
Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655              
2University of Kentucky, Department of Chemical and Materials Engineering, Lexington, USA, ou_persistent22              
3Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              
4Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657              

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Language(s): eng - English
 Dates: 2006-02-07
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Method: -
 Identifiers: DOI: 10.1063/1.2173548
 Degree: -

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Title: 8th International Workshop on Stress-Induced Phenomena in Metallization
Place of Event: Dresden; Germany
Start-/End Date: 2005-09-12 - 2005-09-14

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Title: AIP Conference Proceedings
  Abbreviation : AIP Conf. Proc.
Source Genre: Journal
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Publ. Info: Melville, NY : AIP Publishing
Pages: - Volume / Issue: 817 Sequence Number: - Start / End Page: 185 - 191 Identifier: ISSN: 0094-243X
CoNE: /journals/resource/954928528968