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  A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films

Matoy, K., Schönherr, H., Detzel, T., Schöberl, T., Pippan, R., Motz, C., et al. (2009). A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films, 518(1), 247-256. Retrieved from DOI: 10.1016/j.tsf.2009.07.143.

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Item Permalink: http://hdl.handle.net/11858/00-001M-0000-001A-27BE-0 Version Permalink: http://hdl.handle.net/11858/00-001M-0000-001A-27C0-8
Genre: Journal Article
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 Creators:
Matoy, K.1, 2, Author              
Schönherr, H.3, Author              
Detzel, T.4, Author              
Schöberl, T.2, Author              
Pippan, R.5, Author              
Motz, C.6, Author              
Dehm, G.2, 7, Author              
Affiliations:
1Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, A-9524 Villach, Austria, ou_persistent22              
2Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, A-8700 Leoben, Austria, ou_persistent22              
3Infineon Technologies AG Austria, Villach, Austria, ou_persistent22              
4Infineon Technologies Austria AG, A-9500 Villach, Austria, ou_persistent22              
5Erich Schmid Institute of Materials Science, Austrian Academy of Sciences and Department Material Physics, Leoben, Austria, ou_persistent22              
6Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22              
7Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22              

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 Abstract: A comprehensive study on the mechanical behavior of plasma enhanced chemical vapor deposited silicon oxide, oxynitride and nitride thin films is provided. Hardness, Young's modulus, yield stress, fracture stress and fracture toughness values are determined by the nanoindentation and the micro-cantilever deflection technique. The micro-cantilever deflection technique is discussed in terms of measurement accuracy and reproducibility and the results are compared with standard nanoindentation measurements. Correlations between the yield and fracture behavior, which have been observed for glass fibers, are discussed in this paper for dielectric thin film glasses.

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 Dates: 2009-11-02
 Publication Status: Published in print
 Pages: -
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 Rev. Method: -
 Identifiers: URI: DOI: 10.1016/j.tsf.2009.07.143
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Title: Thin Solid Films
Source Genre: Journal
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Publ. Info: Lausanne, Switzerland, etc. : Elsevier
Pages: - Volume / Issue: 518 (1) Sequence Number: - Start / End Page: 247 - 256 Identifier: ISSN: 0040-6090
CoNE: /journals/resource/954925449792