English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
  The Relation Between Molecular Packing or Morphology and Chemical Structure or Processing Conditions: the Effect on Electronic Properties

Kumar, P., Shivananda, K. N., Zajaczkowski, W., Pisula, W., Eichen, Y., & Tessler, N. (2014). The Relation Between Molecular Packing or Morphology and Chemical Structure or Processing Conditions: the Effect on Electronic Properties. Advanced Functional Materials, 24(17), 2530-2536. doi:10.1002/adfm.201303571.

Item is

Files

show Files

Locators

show

Creators

show
hide
 Creators:
Kumar, P. , Author
Shivananda, K. N., Author
Zajaczkowski, Wojciech1, Author           
Pisula, Wojciech1, Author           
Eichen, Y., Author
Tessler, N., Author
Affiliations:
1Dept. Müllen: Synthetic Chemistry, MPI for Polymer Research, Max Planck Society, ou_1800289              

Content

show

Details

show
hide
Language(s): eng - English
 Dates: 2014
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: DOI: 10.1002/adfm.201303571
 Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show
hide
Title: Advanced Functional Materials
  Other : Adv. Funct. Mater.
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: Weinheim : Wiley-VCH Verlag GmbH
Pages: - Volume / Issue: 24 (17) Sequence Number: - Start / End Page: 2530 - 2536 Identifier: ISSN: 1616-301X
CoNE: https://pure.mpg.de/cone/journals/resource/954925596563